about us
Shenzhen Pingchen Semiconductor Technology Co., Ltd. was established in 2015. It is a high-tech enterprise dedicated to the research and development, production, sales and service of semiconductor packaging equipment. The company introduces foreign advanced technology and develops a series of fully automatic die bonding machines suitable for SMA, SMB, SOD, TO, IGBT, COB, Mini Bridge, Circuit, BGA, IC and other package types.
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